Siemens to launch SIPLACE SX
Siemens Electronics Assembly Systems (SEAS) will unveil its new SIPLACE SX placement machine at the SMT/Hybrid/Packaging Show in Nuremberg next week.
SMT & InspectionThe new SIPLACE SX is the first placement machine with full gantry modularity - a new technology that makes line reconfigurations a thing of the past.
Another European premier is the new SIPLACE MultiStar. It is the first placement head that combines Collect & Place and Pick & Place modes and is thus able to process an exceptionally broad component spectrum at maximum speeds.
The new SIPLACE SX delivers a solution for ever-more-frequent product changes and demand fluctuations. It gains additional flexibility from the 12-nozzle SIPLACE MultiStar placement head with CPP (Collect & Pick & Place) technology, which switches automatically to the most efficient placement mode.
Ferrari: Too hot to handle
GeneralThe Italian sports car manufacturer Ferrari is recalling 1'200 cars, as several caught fire.
Titoma with new Country Manager France
EMSEMS-provider Titoma appoints Alain Traverso as Country Manager France.
Foxconn likely to speed up inland move in China
EMSFoxconn is likely to speed up moving production to inner China locations.
Bree completes ISO audit
PCBBree, part of French Cire Group, has successfully completed the ISO TS 16949 audit.

