Havoc, CSBC to field autonomous surface vessels in Taiwan
US-based Havoc and CSBC will work toward pairing CSBC’s shipbuilding and production capabilities with Havoc’s collaborative autonomy technology, integrating Havoc’s autonomy software onto CSBC-built platforms produced and sustained in Taiwan.
IBM, Dallara to advance AI and quantum-powered design for vehicles
The work combines Dallara’s expertise in high-performance vehicle engineering with IBM’s expertise in AI for physics and quantum computing to investigate how to accelerate aerodynamic design and open a path to even more advanced simulation workflows.
Hitachi, Bloom Energy to deliver on-site power solutions in Japan
Through this collaboration, Hitachi will accelerate the deployment of on-site power solutions for data centers and industrial facilities by combining its control and system integration capabilities with Bloom Energy's fuel cell technology.
Sponsored content by Koh Young Europe
Koh Young Europe Highlights Smart AI Solutions at EFX Stuttgart
Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6 to 8, 2026, at Messe Stuttgart. The new industry event will bring together experts, manufacturers, and suppliers to explore innovations, exchange ideas, and build partnerships across the electronics manufacturing process chain.
Tata Advanced Systems, JJV sign MoU for missile co-production in India
Tata Advanced Systems Limited and Javelin Joint Venture (JJV), a partnership between Raytheon and Lockheed Martin, will explore the establishment of a final assembly and integration facility for the Javelin AUR and component production capabilities in India.
TUSK IC raises €15M to move its satellite chips into mass production
In combination with mainstream CMOS semiconductor technology, the TUSK IC solution brings scalable, affordable connectivity to the next generation of LEO and MEO (Low & Medium Earth Orbit) satellite constellations.
Bittium partners with Safran on advanced tactical communications
Bittium is a supplier of resilient tactical communications systems, secure mobile communications and software-defined radio technology. The companies will explore how their capabilities can be combined to meet the communications needs of the French armed forces.
Is Honda planning $2.5B investment in Ohio hybrid vehicle plant?
Honda plans to invest about USD 1.90 billion to USD 2.53 billion in the new facility, which is slated to start production in 2030, Nikkei reports.
Synopsys, TSMC partner to accelerate AI systems innovation
Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity.
Finnish startup Verda raises €163M to scale full-stack AI cloud
The funding allows the Helsinki-based company to accelerate product development across all layers of its AI cloud, from compute capacity to platform services for frontier AI teams in the agentic era.
Tata Electronics, Kelington to advance development of Dholera Fab
Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.
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