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Rantelon-deal

EMS provider Incap’s German subsidiary and Estonian defence electronics company Rantelon are starting a sales and business development partnership. The aim is to bring Rantelon’s radio frequency and electronic warfare technologies to makers of unmanned systems in Germany, Austria and Switzerland.

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Powell Electronics Europe, which supplies connectors and components for high-reliability applications, has added new support teams in Germany and Poland. The company expects to grow by about 40% this year compared with 2025.

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US photonics company Aeluma has bought an Aixtron G10-AsP system to expand production of photodetectors and lasers on its non-indium phosphide (non-InP) platform. The tool supports 150 mm and 200 mm wafers and has been configured for Aeluma’s own processes.

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Munich-based investment firm Fidelium Partners has agreed to become majority owner of Danfoss’s automotive power module business, which will be spun out into a new joint venture with Danfoss. Around 600 employees and the production sites in Flensburg and Nuremberg, Germany, will move to the joint venture.

Sponsored content by TME Transfer Multisort Elektronik

Various types of displays remain the most user-friendly elements of human-machine interfaces (HMIs) – they are intuitive, provide programmers with a way to convey clear messages, and are easy to connect to microcontroller-controlled devices.

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German software company Luminovo is opening its platform for electronics quoting and procurement to AI assistants such as ChatGPT, Claude and Microsoft Copilot. EMS providers and electronics manufacturers will be able to query their own supply chain data in plain language, and build their own tools on top of it.

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Swedish EMS provider Note has secured additional business with an existing customer in security and defence. The business is expected to generate sales of around SEK 80–100 million (EUR 7–9 million), with deliveries during 2027.

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Arrow Electronics has launched Capstone, a new global business dedicated to interconnect, passive and electromechanical (IP&E) components. The launch is part of a wider realignment of Arrow’s components business, which is moving from a geographic to a technology-based operating model.

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Ferrotec has opened its second manufacturing plant in Kulim, Malaysia, which will create more than 1,000 new jobs. The new plant brings the company’s total investment in its two Kulim sites to about MYR 1.9 billion.

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With a 15% global market share, WT Microelectronics will serve as a strong global distribution partner for Sivers’ InP (Indium Phosphide) lasers and wireless beamformer products and solutions, connecting its product portfolio and availability at scale with customers globally.

The collaboration seeks to boost the companies’ competitive position in India’s market. By leveraging their resources and capabilities, Sanken Electric and Kaynes aim to mitigate risks associated with fluctuations in demand while maximizing investment efficiency.

French electronics distributor Steliau Technology has completed its acquisition of the UK-based Acal BFi Group, which includes Impulse Embedded and Arcobel Embedded Solutions. The combined group will have revenue approaching EUR 1 billion.

Amkor has broken ground on an expansion of its campus in Gwangju, South Korea, to meet rising demand for advanced packaging for AI and accelerated computing. The new building will add capacity at a site that has been part of Amkor’s Korean operations since the 1990s.

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Rising contract prices for mobile DRAM are leading more smartphone brands to use reballed memory in their cheapest models. According to TrendForce, reballed memory will account for about 3–4% of the smartphone market in 2026, and could reach 7–9% in 2027.

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Infineon expects revenue of about EUR 20 billion in fiscal 2027, which runs from October 2026 to September 2027. That would be an increase of more than 20%, driven by data centres, power infrastructure and software-defined vehicles. Revenue from power supplies for data centres alone is projected to reach close to EUR 4 billion.

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German equipment maker SCHMID Group has received an order for wet-process equipment for a new glass core substrate plant in South Asia. The customer is a US company specialising in glass-based advanced packaging, which is now moving its technology from pilot production to industrial scale.

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Creation Technologies is investing in a new ISO Class 7 cleanroom at its plant in Changzhou, China, as part of a move into more integrated medical device assembly. The facility is scheduled for completion in March 2027.

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Swiss EMS provider Cicor has won two multi-year defence programmes, one of them from a new customer. The two awards are expected to generate revenue of close to CHF 20 million as early as 2027.

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The PCB industry ended 2025 with revenue of about USD 88 billion and is forecast to reach USD 140 billion by 2031, an average annual growth rate of 8%. But according to Yole Group, that average hides two industries moving in opposite directions: an AI segment growing by 45 to 70% a year, and a commodity segment that is barely growing at all.

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The solution establishes a unified digital thread by connecting people, processes and data across the semiconductor lifecycle, from IP management, new product introduction and supplier collaboration to quality and regulatory compliance.

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Under the agreement, Mitsubishi Electric will transfer to Lin Yin 50% of its stake in Mitsubishi Electric Mobility, which handles Mitsubishi Electric’s automotive equipment business, after which the two co-owners will jointly operate Mitsubishi Electric Mobility.

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Würth Elektronik and German PCB manufacturer Starteam Global are expanding their cooperation into a strategic partnership. The first step is a joint online PCB shop, and customers will also get access to the two companies’ combined manufacturing networks in Europe and Asia.

ICs

European distribution of electronic components grew by 42.7% YoY to EUR 5.4 billion in the third quarter, according to DMASS. For the first nine months, sales rose by 30.2% to EUR 15.0 billion.

US company Diamond Foundry says it has grown the first single-crystal diamond with a diameter of 200 mm, the same size as a standard semiconductor wafer. The company sees it as a step towards using diamond as a substrate material in chip manufacturing.

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Ericsson has launched a system that uses the mobile network to detect and track drones, including those that aren’t connected to the network. The first small-scale, sensing-only commercial pilots are expected to start in 2027, with wider deployments from 2028.

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Empa Electronics reported a 26% increase in revenue in the first half of 2026 compared with the same period a year earlier. The Turkish company plans to sustain its growth through R&D investment, geographical expansion and acquisitions of technology companies. Speaking to Evertiq at Evertiq Expo Warsaw 2026, Gabor Sirom of Empa Electronics discussed the company's strategy, the state of Turkey's electronics industry and the outlook for the wider market.

tata

Three contract workers have died after inhaling gas at Tata Electronics’ component factory in Hosur, southern India. The plant supplies parts for Apple’s iPhones, and the incident adds to a series of problems at the site.

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Infineon has processed 300 mm silicon carbide (SiC) wafers into functional power devices at its fab in Villach, Austria, using existing silicon manufacturing equipment. The company says it’s the first to do so in a full-scale semiconductor fab.

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US PCB manufacturer Summit Interconnect has acquired Mega Circuit, which specialises in RF and microwave printed circuit boards.

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US materials company Advanced Chip and Circuit Materials (ACCM) is expanding its manufacturing capacity in La Crosse, Wisconsin, for its Celeritas family of dielectric materials for AI hardware. None of the materials depends on T-glass or quartz fabric, which are in short supply.

PCB-India_2

The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification.

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The funding comprises USD 42 million in planned investment from Obayashi Corporation, a Tokyo-listed Japanese construction group. Infradebt, an Australian renewables infrastructure lender, is also providing a USD 56 million lending facility.

Taiwanese laminate maker Ventec International Group and MICAM are developing a joint venture to start production of copper-clad laminate (CCL) at MICAM’s plant in Mallow, Ireland. The aim is to give European customers a source of PCB base materials for defence applications made within the EU.

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