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ASML unveils EUV light source upgrade to boost chip output by 50% by 2030
ASML has developed an upgraded extreme ultraviolet (EUV) light source for its lithography machines, which the company says could increase chip production by up to 50% by the end of the decade, Reuters reports.
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SEALSQ and WISeKey to relocate Geneva HQ, launch quantum hub
SEALSQ Corp and its parent WISeKey International Holding, are planning to move their Geneva headquarters to the Pont-Rouge district in August 2026. The relocation coincides with the launch of the Geneva Quantum Centre of Excellence, intended to consolidate the group’s research and industrial deployment of quantum computing, post-quantum cybersecurity, and secure semiconductor technologies.
Volvo Cars to recall 40,000 EX30 over battery risk
Volvo Cars will recall more than 40,000 EX30 electric SUVs due to a risk of battery pack overheating, the company told Reuters. The EX30 is one of the automaker’s best-selling electric models.
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Cadence completes acquisition of Hexagon’s D&E business
US-based Cadence Design Systems has completed its acquisition of the Design and Engineering (D&E) business from Swedish technology group Hexagon AB, in a deal valued at approximately EUR 2.7 billion.
Phison warns: RAM shortage could wipe out companies
Phison, a major manufacturer of controller chips for SSDs and other flash memory devices, has warned that the ongoing global RAM shortage could impact the entire industry in 2026.
DATA MODUL expands EMS with full assembly and supply chain services
DATA MODUL is expanding its industrial product assembly services, offering end-to-end manufacturing solutions designed to increase flexibility, quality, and planning reliability, the company states in a press release.
SoftBank’s SAIMEMORY and Intel collaborate on next-gen Z‑Angle memory
SoftBank's subsidiary SAIMEMORY has signed a collaboration agreement with Intel Corporation to advance the development and commercialisation of Z‑Angle Memory (ZAM), a next-generation memory technology designed for high capacity, high bandwidth and low power consumption.
Sony and TCL plan joint venture in home entertainment
Japanese electronics manufacturer Sony and TCL Electronics Holdings Limited have signed a memorandum of understanding (MoU) to explore the establishment of a joint venture in the home entertainment segment.
SICK expands manufacturing capacity in Hungary
German sensor manufacturer SICK has inaugurated a capacity expansion at its site in Kunsziget, Hungary, following a EUR 30 million investment that has created more than 300 new jobs.
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