Evertiq - First In Electronics News & Expo

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As part of the transaction, Eni Industrial Evolution is acquiring a 30% stake in a newly established company established by FIB, of which FIB will retain a 70% stake. The consideration for the stake includes a fixed component of EUR 55 million.

Riku-Hynninen

EMS companies have been recently publishing mainly positive headlines related to growth and improving profitability. Even the most struggling companies, Lacroix and TT Electronics, are indicating a comeback after serious restructuring in the Americas region. This is very welcome news for the industry after all the recent crises impacting demand and supply chain.

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DTE_agreement

The agreement will support eight projects with battery systems delivered over a two-year period. The energy storage projects will deliver 1.5 gigawatts of battery storage or 6 gigawatts hours in Michigan.

Specialtrasfo

The offering ABB is acquiring focuses on specialized transformers for various industrial applications including energy, marine, metals, mining, industrial processing and offshore applications adding a key building block to its powertrain offering.

Sponsored content by TME Transfer Multisort Elektronik

Panasonic offers a wide range of components designed for industrial automation applications. Among them, miniature photoelectric sensors are particularly popular, valued for their compact dimensions, high precision of operation, and reliability in demanding applications. Let’s check what functions these solutions offer and what distinguishes them in terms of technical parameters.

EV_charging_geralt

Through this collaboration, EV drivers using the Presto platform will gain streamlined access to bp pulse’s growing network of DC fast chargers across the US.

New-Glenn

Jeff Bezos' Blue Origin suffered a significant setback on Thursday when its New Glenn rocket exploded on the launchpad at Cape Canaveral, Florida, during a hot-fire test, Reuters reports.

The investment is part of Indian startup C2i Semiconductors’ USD 16.7 million Series A funding round, which includes participation from Peak XV Partners and other investors

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Through this collaboration, Fujitsu will gain early access to Anthropic’s latest AI models and, by developing and delivering solutions that utilize these models, will provide customers with more advanced and practical AI applications.

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The collaboration between Vector and NXP Semiconductors focuses on accelerating the industrialization of Software-Defined Vehicles (SDV). The latest outcome of this collaboration is the newly released NXP CoreRide Z248 zonal reference system.

The US startup is developing a space-based energy infrastructure layer that delivers electricity on demand to satellites and other spacecraft using optical power beaming. The Series A positions Star Catcher to move from validated technology to scalable infrastructure.

Czechoslovak Group (CSG) has signed a preliminary agreement to acquire DOMAR MS, a Warsaw-based manufacturer of cable harnesses, cabling, electrical boxes and specialised connectors for the defence sector. The transaction is CSG's first acquisition in Poland.

Siemens and Jabil have announced plans for a new 300,000-square-foot manufacturing facility in Prince George County, Virginia, where Jabil will produce medium-voltage switchgear and integrated power distribution solutions on Siemens' behalf. Production is scheduled to begin in autumn 2026.

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Less than a week after parent company Wingtech filed a CNY 8 billion lawsuit against its interim leadership in a Chinese court, Nexperia has announced a manufacturing partnership with US-based foundry Polar Semiconductor for the production of next-generation power MOSFETs.

US semiconductor packaging and test provider Amkor Technology has secured an additional 67-acre parcel of land adjacent to its existing campus in Peoria, Arizona, expanding its footprint for future advanced packaging and test capacity.

Zirconn-2026

Zirconn is expanding its manufacturing capabilities in China. The company has launched a new SMT assembly division aimed at increasing its capacity to deliver advanced electronic projects for customers in Europe and international markets.

Aerospace

The Indian startup's fully battery-powered Gen #2 prototype aircraft can carry an active payload target of above 200 kg, operates under a 500 kg maximum take-off weight, and uses a lift plus cruise configuration.

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The financing round was led by Accel, Factorial Funds, and Founders Fund, with participation from Conviction, Gigascale, 01A, Felicis, Buckley Ventures and 8VC, alongside existing backers.

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Swedish EMS provider NOTE has inaugurated a new production facility in Torsby, Värmland. The factory doubles the company's production floor space at the site and is built for advanced electronics manufacturing serving customers in defence, medical technology and other demanding segments.

2Raymond-Goh

The global raw material supply continues to pressure the electronic industry and not least the PCB manufacturing sector. What initially affected a narrow range of high-frequency materials has now evolved into a broader scope, impacting both advanced laminates and standard FR-4 materials.

He-Tingbo

At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.

Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.

Indie

The company’s architecture is designed to support real-time analytics, contextual decision-making, and seamless interoperability with customer-owned Artificial Intelligence models and digital systems.

Quantum_Wafer

The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.

This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.

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Doosan Robotics has opened an expanded European branch in Frankfurt, Germany, as part of its efforts to accelerate business growth across the region.

Chongqing

Austrian PCB and IC substrate manufacturer AT&S is expanding capacity at its Chongqing facility in China to meet growing demand for high-end IC substrates from a key customer in the AI segment.

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The combined revenue of the world's five largest NAND Flash suppliers jumped 83.7% quarter-on-quarter in the first quarter of 2026, surpassing USD 38.9 billion. Surging demand for enterprise SSDs from AI infrastructure buildout, combined with constrained supply, pushed prices well above expectations, according to TrendForce.

Expo-ber25-9

The German electronics industry is entering a period defined less by stability and more by adaptation. For years, the sector benefited from a model built on industrial strength, global supply chains and close ties between manufacturing and export-driven growth. Today, many of those assumptions are being re-evaluated.

US memory manufacturer Micron has begun 1-alpha DRAM manufacturing at its Manassas, Virginia facility — the most advanced memory technology ever produced in the United States, according to the company. The more than USD 2 billion investment will quadruple Micron's DDR4 wafer supply at the site.

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The fresh funding will be deployed to advance the company’s product R&D roadmap across custom power semiconductors and custom ASSPs, build in-house chip validation and testing infrastructure, and support working capital requirements.

Lab

Award marks Rocket Lab's first satellite production program for geostationary orbit and continues a Space Systems Command program for development and delivery on orbit of two Heimdall prototype payloads by Rocket Lab Optical Systems.

Currently, China’s most advanced proven chipmaking capability is believed to be around 7nm, and experts say 1.4nm is likely the global limit for advanced chipmaking around the end of the decade. So the Chinese tech giant’s claims could represent a breakthrough.

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