EU clears €76 million German state aid for QuantumDiamonds
The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.
Nearfield Instruments raises $380 million in largest ever Dutch deep-tech round
Rotterdam-based semiconductor metrology company Nearfield Instruments has closed a USD 380 million Series D funding round, valuing the company at USD 1.6 billion. The round is the largest deep-tech funding round ever completed in the Netherlands.
QCi acquires NHanced in deal valued at up to $145 million
By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.
NLCIL partners with IOCL to boost renewable energy in Tamil Nadu
NLC India Ltd (NLCIL), which has a presence in mining and power generation, has been diversifying into large-scale renewable and green energy initiatives, including solar, wind, pumped hydro storage and BESS.
Ubotica raises $11M to scale real-time maritime intelligence
The investment will accelerate the commercial rollout of Irish firm Ubotica’s Live Maritime Intelligence platform, which enables governments and maritime agencies to detect emerging threats across maritime territories in real time.
Infineon wins two more patent cases against Innoscience in Germany
A Munich district court has ruled in favour of Infineon Technologies in two further patent infringement cases against Chinese GaN manufacturer Innoscience. It is the third and fourth legal defeat for Innoscience in an ongoing series of proceedings across Germany and the United States.
Bosch to pay $36 million penalty for unlicensed shipments to Huawei
Robert Bosch GmbH has agreed to pay a USD 36 million penalty to the US Bureau of Industry and Security after shipping MEMS sensor products and software to Huawei and its affiliates without the required export licence. The shipments took place between September 2020 and September 2024.
TTM Technologies opens Ultra-HDI PCB facility in Syracuse
TTM Technologies has opened a new Ultra-HDI printed circuit board manufacturing facility in Syracuse, New York, in the United States. The USD 130 million investment – including USD 30 million from the US Department of War – is set to create up to 400 new jobs and bring TTM's total workforce in the region to approximately 1,000.
OPmobility, ProLogium sign MoU to develop solid‑state battery packs
France’s OPmobility will be responsible for the design, development and manufacturing of battery modules utilizing the solid-state battery cells provided by Taiwanese company ProLogium.
Adam Ryder appointed Managing Director of Incap UK
EMS provider Incap has appointed Adam Ryder as Managing Director of Incap Electronics UK, effective June 17. He joins the company's extended management team.
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