Electronics Reliability for Demanding Applications
In modern electronics, reliability is no longer solely a characteristic of an individual component. In defense systems, automation, robotics and transportation, the success of a project depends on an entire chain of interdependencies: from accurately defining operating conditions, through the selection of materials and technologies, to component availability, manufacturing capabilities and product lifecycle management.
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Kitron breaks ground on new factory in Örnsköldsvik
Kitron has broken ground on its new production site in Gålnäs, Örnsköldsvik, Sweden. Construction is starting earlier than planned. In the spring, the company expected construction to begin in early 2027.
Variosystems expands coating and bonding capabilities in Steinach
Swiss EMS provider Variosystems is expanding its conformal coating, gluing and specialised manufacturing capabilities at its site in Steinach. The investments target customers in highly regulated industries such as Aerospace & Defence and Medtech & Life Science.
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Koh Young Europe Highlights Smart AI Solutions at EFX Stuttgart
Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6 to 8, 2026, at Messe Stuttgart. The new industry event will bring together experts, manufacturers, and suppliers to explore innovations, exchange ideas, and build partnerships across the electronics manufacturing process chain.
AI demand squeezes consumer MLCCs – opening doors for Chinese suppliers
Japanese and Korean MLCC makers are cutting supply to the consumer market to prioritise capacity for AI applications. The shift is opening doors for Chinese suppliers, several of which are now undergoing qualification with global brands such as Dell, HP, ASUS and Acer, according to market research firm TrendForce.
Scanfil raises growth target to 15% a year
Scanfil is raising its long-term turnover growth target from 10% to 15% on average per year over the business cycle. At the same time, the EMS provider is giving itself more financial room for further acquisitions.
Tata Electronics partners with Besi to strengthen packaging capabilities
Leveraging Besi’s portfolio of advanced packaging solutions and global expertise, the collaboration will support the technology readiness of Tata Electronics’ semiconductor packaging facility in Assam and advance its journey toward next-gen packaging capabilities.
VSMC opens its first 12-inch fab in Tampines, Singapore
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.
Havoc, CSBC to field autonomous surface vessels in Taiwan
US-based Havoc and CSBC will work toward pairing CSBC’s shipbuilding and production capabilities with Havoc’s collaborative autonomy technology, integrating Havoc’s autonomy software onto CSBC-built platforms produced and sustained in Taiwan.
IBM, Dallara to advance AI and quantum-powered design for vehicles
The work combines Dallara’s expertise in high-performance vehicle engineering with IBM’s expertise in AI for physics and quantum computing to investigate how to accelerate aerodynamic design and open a path to even more advanced simulation workflows.
Hitachi, Bloom Energy to deliver on-site power solutions in Japan
Through this collaboration, Hitachi will accelerate the deployment of on-site power solutions for data centers and industrial facilities by combining its control and system integration capabilities with Bloom Energy's fuel cell technology.
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