Evertiq - First In Electronics News & Expo

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Axcelis Technologies has broken ground on a new manufacturing facility for ion implantation equipment in Pyeongtaek, South Korea.

Qualcomm will cut jobs worldwide following its annual employee reviews, Reuters reports, citing an internal memo from CEO Cristiano Amon. Employees will start receiving notifications in November.

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Arkema has opened an expansion of its R&D centre in Shanghai, adding around 20% more laboratory space. The French materials group is also building a new laboratory in Guangzhou focused on electronics and battery customers.

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DevDroid-partnership

Inission Norway has signed a memorandum of understanding with Ukrainian defence company DevDroid. The two companies will explore cooperation in the manufacturing of electronics and remote control systems for unmanned ground vehicles.

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Neways has signed a multi-year partnership with Melexis covering the packaging of Melexis’ Triphibian pressure sensors. The sensors are used in thermal management for electric vehicles and AI data centres.

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UK electronics manufacturer TechPoint has acquired Esprit Electronics, an EMS provider based in Southampton. All 92 Esprit employees join the TechPoint Group, and the company will keep operating from its current facilities.

Toshiba plans to double its production capacity for hard disk drives (HDDs) used in AI data centres within fiscal 2027, compared with 2025 levels, Nikkei reports. The company will invest around JPY 60 billion (about USD 380 million) in expanding its plant in the Philippines.

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Armscor_MOU

The agreement establishes a framework for potential technology cooperation between India and South Africa across defence, aerospace and dual-use technologies.

The facility refinances existing project-level debt across four Australian BESS assets (Brendale, Orana, Ulinda Park and Elaine) into a single portfolio-level financing structure.

The order includes 113 three-car Mireo Plus B trains, an extensive 30-year service package, and the construction of two Rail Service Centers in Lower Saxony.

Volvo Cars is extending its partnership with Nvidia to develop automated driving for its future cars. The aim is for the cars to handle everything from highways and city traffic to parking, and to gradually introduce eyes-off and mind-off driving.

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This expansion will further strengthen Taiwanese firm E&R Engineering Corp’s supply capabilities in Southeast Asia, delivering real-time technical support and supply chain flexibility to semiconductor and OSAT customers.

TSMC plans to build a new 3nm fab in Tainan, with production slated to start in the first half of 2028. The company is also moving some 5nm capacity over to 3nm as demand for its leading-edge processes continues to grow.

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EPC Power is now part of Flex’s Cloud and Power Infrastructure segment, expanding the company’s capabilities across power, cooling and compute to address growing demand for higher-density AI infrastructure and next-generation 800V data center power architectures.

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The agreement extends Indian space launch company Skyroot’s commercial launch and supports US-based space tech startup Reflect Orbital’s phased development and deployment plans.

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Through this agreement, Flip Electronics will distribute Synaptics’ expansive portfolio of embedded compute, wireless connectivity, and sensing solutions, focusing on aged, end-of-life, and obsolete devices that support innovation across automotive and IoT market.

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Technology Industries of Finland publishes its recommendations on the Chips Act 2.0. The Commission has built the right framework. Whether it works depends on where the money goes and who decides.

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The alliance combines MHI’s expertise in integrated power, cooling and energy management with Ingeteam’s expertise in rotating electrical machines, power electronics, control and automation and digital technologies.

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The London-based startup will use the investment to grow its engineering and commercial teams, bring its products to market, support customers as they adopt its chips, and strengthen its presence in the US alongside its UK and European base.

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The addition of TCS Industries, TCS Electronics, and Precision Grinding & Manufacturing Corporation reinforces Fathom’s ability to address growing demand for precision components, integrated electronics and complex assemblies.

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Autonomous machines need three kinds of computing to work together so they can perceive, think and act in the real world. German startup Ubitium is building one universal processor to replace the stack of specialised chips.

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Foxconn has reached a final agreement with Mitsubishi Electric to buy half of Mitsubishi Electric Mobility for JPY 115 billion (EUR 646.3 million). The two companies will then run the automotive equipment business together.

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Under the agreement, Vikram Solar will supply its high-efficiency N-Type TOPCon G12R modules, featuring glass-to-glass construction and bifacial technology, with power ratings ranging from 615–625 Wp.

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Founded in 2024, Prague-based AISLE has developed AI systems capable of discovering, validating and helping remediate previously unknown vulnerabilities in complex production software.

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Mass production and fabrication, volume assembly and testing will sit in proximity in the new facility, enabling shorter development cycles, improved production yields and a faster path from prototyping to commercial-scale mass production.

NLR

The next phase of cooperation aims to focus on connectivity to the Dutch industrial base, coordination on military operational analysis, alignment on technology roadmaps, and collaboration on Unmanned Aerial Systems (UAS).

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The Foundry will help enterprises embed intelligence into core engineering and manufacturing workflows for aerospace, mobility, semiconductors, medical devices, industrial electronics, utilities and energy.

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The funds will be used to accelerate development and commissioning of Fortastra’s on-orbit security platforms, expand the US company’s engineering and operations team, and continue developing its core autonomy and manufacturing capabilities.

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The fresh funding will enable the Spanish company to scale and industrialize its quantum computers, advance the development of new generations of chips, and increase its manufacturing and deployment capacity.

Kulim

Infineon has signed a multi-year agreement with Wolfspeed for the supply of 200mm silicon carbide (SiC) wafers. The deal moves the companies’ existing supply relationship from 150mm to 200mm substrates.

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ASML’s planned capacity for 2027 and 2028 will not fully meet customer demand, the company now says. ASML is therefore looking at ways to expand capacity beyond what it has already announced. Third-quarter sales reached a record EUR 11.7 billion.

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