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Lansing_battery_plant

With the opening of its Lansing facility, LG Energy Solution now operates two facilities in Michigan, located in Holland and Lansing. The South Korean company has invested more than USD 5 billion total in the state of Michigan since 2010.

Longum-facility

Kitron has officially opened its new production facility at Longum outside Arendal in Norway, adding approximately 7,500 square metres of manufacturing space. Together with the existing Kilsund site nearby, the two facilities employ approximately 550 people.

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300mm-sic

Coherent has begun sampling its 300mm high thermal conductivity silicon carbide substrates to AI semiconductor partners. The milestone moves the platform from internal development to customer evaluation.

Costa-Rica-2026

German EMS provider Zollner has officially opened an expansion of its Cartago facility in Costa Rica, adding approximately 10,000 square metres of operational space. The expansion is expected to create around 500 additional jobs by 2030 and forms part of the company's Americas 2030 strategy.

semiconductor-revenues-June

Global semiconductor sales reached USD 403.3 billion in Q2 2026, a 35.1% increase compared to Q1, according to the Semiconductor Industry Association. Monthly sales in June alone came in at USD 134.5 billion – up 123.6% YoY and 9.7% from May.

solid-state-battery

Finnish technology company Donut Lab has acquired nanomaterials company Nordic Nano Group, with the entire team transferring to Donut Lab. The acquisition brings together both companies' intellectual property, technology and staff under one roof.

manufacturing-lines

Norwegian EMS provider Kitron has revised its full-year 2026 revenue outlook upward to EUR 1,050–1,150 million, from a previous range of EUR 900–1,050 million. Operating profit guidance is revised to EUR 97–112 million, from EUR 84–108 million.

centre-of-excellence-Phoenix-AZ

Nordson Test & Inspection has opened a new Centre of Excellence in Phoenix, Arizona, in the United States. The purpose-built facility serves as a demonstration, training and testing centre for the company's semiconductor and SMT inspection and metrology solutions.

Power_Bikaner_project

The project will supply energy to Haryana Power Purchase Centre (HPPC), Maharashtra State Electricity Distribution Company Limited (MSEDCL) and Noida Power Company Limited (NPCL).

The smart telematics solution integrates the communications module and multiple antennas into a single unit. LG Electronics has already commenced deliveries to a European automaker, marking the solution’s first deployment in a production vehicle in Europe.

Infineon Technologies has announced the acquisition of C2i Semiconductors, a Bangalore-based company specialising in software-defined multiphase controllers and smart power stages for AI data centre applications. The transaction is expected to close in Q3 2026.

The ERA’s (Electric Regional Aircraft) propulsion architecture will consist of eight electric propulsion units powered by two TG600 turbogenerators, each capable of supplying 600 kW of electricity.

Teleflex

The company said it remains committed to its capital deployment priorities, including debt reduction of USD 800 million and completing its USD 1 billion share repurchase authorization.

Oita_building

This investment will significantly expand production capacity for post-CMP cleaners used in the manufacturing of advanced semiconductors, including those for AI applications, for which demand is growing rapidly.

Indie

The collaboration will initially focus on opportunities in India, where both companies see significant potential to support manufacturing and industrial customers through a broader range of supply chain and engineering services.

Siemens expands manufacturing capacity with two new factories in US, producing the critical electrical backbone for AI infrastructure. Investments strengthen a global portfolio spanning power distribution, automation, digital twins, EDA and industrial AI

Micron Technology has launched the Micron Ventures Paradigm Fund, a USD 250 million investment vehicle targeting startups across the AI technology stack. It is Micron Ventures' third and largest fund to date, bringing the unit's total capital commitment to USD 550 million.

Aerospace_North_Charlestown

The upgraded facility positions the company to support both current production and future engine platform opportunities. The company is also strategically insourcing key manufacturing processes to enhance production agility.

Energy_Mokoan_project

Deutsche Bank has provided a non-recourse financing package to refinance the existing debt on the operational Mokoan Solar Farm in Victoria, Australia, and support construction and operation of the co-located 40 MW/80 MWh BESS.

GeneSiC

Under the terms of the agreement, Magnachip will license Navitas’ GeneSiC Trench-Assisted PlanarTM (TAP) technology to enter the HV and UHV SiC markets. The license covers 1200 V, 2300 V, 3300 V and higher voltage GeneSiC technologies.

centre_of_excellence

Advanced Land Autonomy Centre of Excellence (ALACOE UK) will serve the local market, bringing world-leading ground autonomy directly to the UK market. The network of centres will also amplify Canada’s leading role in autonomous ground autonomous systems across Europe.

Samsung-SDI-Prismstack

Samsung SDI has signed a new joint development agreement with General Motors for next-generation prismatic batteries, while simultaneously acquiring GM's 49.99% stake in their joint venture SynergyCells in New Carlisle, Indiana. The plant will initially be used for energy storage system production rather than electric vehicle batteries.

Electronics_Ananth_Tech

The partnership will focus on indigenous design and development, system engineering, electronics manufacturing, integration, testing and production for current and future programmes of strategic importance.

Micron Research Labs will center on a flagship Boise campus designed to support advanced research across critical technology domains. Key research areas include critical memory technologies, advanced memory and compute architectures, packaging and future semiconductor manufacturing.

Vietnam

At its existing site in Yen Binh, the German company will build a new air separation unit capable of producing 600 metric tons per day of nitrogen, oxygen and argon. Additionally, Messer will build a new nitrogen liquefier at its site in Song Cong.

Energy_BESS

Following the close of the transaction, Stryten will operate 15 battery manufacturing and component facilities across the US. This expanded footprint will strengthen Stryten’s vertically integrated manufacturing supply chain and its ability to produce energy storage solutions.

EMS provider Flex and AI systems company Cerebras have expanded their manufacturing partnership to increase production of the Cerebras CS-3 AI accelerator system at Flex's Milpitas, California facility. Production capacity is expected to grow approximately seven times through 2026.

motor

The funds will be used to support the development of an extended range of rare-earth free motors with a focus on heavy commercial vehicle and industrial applications.

ELECTRONICS_Nvidia

Data collected across various environments such as LG’s Data Factory and LG CNS’s logistics automation solutions will be linked with Nvidia’s robotics stack, where it is augmented and synthesized into high-quality data for robot learning.

pexels-handshake

Founded in 1964, Canadian company Leesta Industries specializes in the machining of flight-safety-critical aeroengine components used across a range of commercial and military aircraft platforms.

Rolls-Royce-partnership-2026

TT Electronics has signed a multi-million pound lifetime contract with Rolls-Royce to supply power electronics for all large civil aircraft engines. The agreement covers TT Electronics' multi-chip power modules and precision magnetics, manufactured at its Bedlington and Barnstaple facilities in the United Kingdom.

ASMPT announced in late July bulk orders for more than 50 of its Chip-to-Substrate Thermo-Compression Bonding tools from OSAT customers, for use in advanced AI computing chip packaging.

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