Incap Germany adds new selective soldering system in Karlsfeld
Incap Germany has commissioned a new SEHO SelectLine-C 500 selective soldering system at its Karlsfeld facility, expanding production capacity and automation capabilities for through-hole technology components.
Qualcomm appoints Wassim Chourbaji as President of EMEA
Qualcomm has appointed Wassim Chourbaji as Senior Vice President and President of Qualcomm EMEA, effective immediately. He succeeds Enrico Salvatori, who will retire from Qualcomm in June 2027 after 25 years with the company.
Compal opens AI server manufacturing centre in Taoyuan
Compal Electronics has opened its Daxi AI Server Manufacturing Centre in Taoyuan, Taiwan, following a total investment of NTD 4.03 billion, approximately EUR 108.95 million. The facility is expected to double Compal's AI server production capacity and adds rack-level manufacturing capabilities.
Skyhop plans to introduce Noemi aircraft into Indian market
Under the MoU, SkyHop and Noemi will evaluate the technical, operational, commercial and regulatory requirements for introducing Noemi’s seaplanes into SkyHop’s future fleet. SkyHop plans to introduce up to 10 Noemi amphibious aircraft by FY2030.
Posco Future M signs supply agreement for LFP cathode materials
The agreement, reached to preemptively address surging North American ESS demand, will see Posco Future M supply more than 190,000 tons of LFP cathode materials to a major Korean battery maker over six years.
Terma and Danube Cell Manufacturing sign MoU on battery development and testing
Danish defence and aerospace company Terma and Austrian battery manufacturer Danube Cell Manufacturing have signed a memorandum of understanding to explore joint opportunities in battery development, testing and validation. The collaboration targets aerospace and defence applications.
Lam Research to invest more than $3 billion in global R&D lab network
Lam Research plans to invest more than USD 3 billion over the next five years to expand its global research and development lab network. The investment is expected to increase experiment capacity by more than 50% and further compress product development cycles for semiconductor customers.
Top five NAND Flash brands post 77% revenue surge in Q2
Combined revenue for the top five publicly listed NAND Flash brands rose 77% QoQ in Q2 2026 to USD 68.87 billion, driven by sustained AI server demand for enterprise SSDs and significant contract price increases. Micron posted the strongest growth of the group and moved up to third place, according to TrendForce.
Molex breaks ground on headquarters expansion in Illinois
Molex has held a groundbreaking ceremony marking the start of an expansion and renovation of its global headquarters campus in Lisle, Illinois, in the United States. The project is expected to be completed in December 2027.
Nelco partners with Elveo on next-gen D2D, IoT connectivity
Under the agreement, Nelco will bring reliable, next-generation connectivity and compute solutions directly from Elveo’s satellites in space to varied sectors, including automotive, maritime, energy and government in India and South Asian markets.
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