Amkor breaks ground on new building in South Korea
Amkor has broken ground on an expansion of its campus in Gwangju, South Korea, to meet rising demand for advanced packaging for AI and accelerated computing. The new building will add capacity at a site that has been part of Amkor’s Korean operations since the 1990s.
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High DRAM prices push smartphone makers towards reballed memory
Rising contract prices for mobile DRAM are leading more smartphone brands to use reballed memory in their cheapest models. According to TrendForce, reballed memory will account for about 3–4% of the smartphone market in 2026, and could reach 7–9% in 2027.
Infineon expects more than 20% growth as data centre power nears €4 billion
Infineon expects revenue of about EUR 20 billion in fiscal 2027, which runs from October 2026 to September 2027. That would be an increase of more than 20%, driven by data centres, power infrastructure and software-defined vehicles. Revenue from power supplies for data centres alone is projected to reach close to EUR 4 billion.
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Various types of displays remain the most user-friendly elements of human-machine interfaces (HMIs) – they are intuitive, provide programmers with a way to convey clear messages, and are easy to connect to microcontroller-controlled devices.
SCHMID wins equipment order for glass core substrate plant in South Asia
German equipment maker SCHMID Group has received an order for wet-process equipment for a new glass core substrate plant in South Asia. The customer is a US company specialising in glass-based advanced packaging, which is now moving its technology from pilot production to industrial scale.
Creation Technologies adds cleanroom for medical manufacturing in China
Creation Technologies is investing in a new ISO Class 7 cleanroom at its plant in Changzhou, China, as part of a move into more integrated medical device assembly. The facility is scheduled for completion in March 2027.
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HCLTech, PTC to accelerate semiconductor product lifecycle management
The solution establishes a unified digital thread by connecting people, processes and data across the semiconductor lifecycle, from IP management, new product introduction and supplier collaboration to quality and regulatory compliance.
Foxconn, Mitsubishi Electric finalise alliance for automotive equipment business
Under the agreement, Mitsubishi Electric will transfer to Lin Yin 50% of its stake in Mitsubishi Electric Mobility, which handles Mitsubishi Electric’s automotive equipment business, after which the two co-owners will jointly operate Mitsubishi Electric Mobility.
Würth Elektronik and Starteam Global team up on PCB sourcing
Würth Elektronik and German PCB manufacturer Starteam Global are expanding their cooperation into a strategic partnership. The first step is a joint online PCB shop, and customers will also get access to the two companies’ combined manufacturing networks in Europe and Asia.
European component distribution up 43% in Q3 as memory prices soar
European distribution of electronic components grew by 42.7% YoY to EUR 5.4 billion in the third quarter, according to DMASS. For the first nine months, sales rose by 30.2% to EUR 15.0 billion.
Diamond Foundry says it has grown first 200 mm single-crystal diamond
US company Diamond Foundry says it has grown the first single-crystal diamond with a diameter of 200 mm, the same size as a standard semiconductor wafer. The company sees it as a step towards using diamond as a substrate material in chip manufacturing.
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