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The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.

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The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

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The 10-year agreement brings together Cellula Robotics’commercial off-the-shelf (COTS) long-endurance autonomous underwater vehicle (AUV) platforms with Metron’s adaptive mission autonomy and undersea warfare and maritime domain expertise.

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Through the strategic alliance, Hitachi will establish and globally deploy Hitachi’s Forward Deployed Engineers (FDEs) model that leverages its strengths in IT, OT, and products cultivated through Lumada, together with Google Cloud’s advanced AI.

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The three parties will work together to build an electric two-wheeler ecosystem that includes Battery Swapping Stations in central Hanoi, battery standards, safety management systems, and new platform-based business models for electric two-wheelers.

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The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.

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The companies plan to combine Hitachi’s IT expertise, operational technology and product manufacturing knowledge with Intel’s computing capabilities and silicon-based platforms to develop next-gen compute capabilities and industry solutions.

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Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.

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The partners will use the platform to conduct research on the application of near-term quantum and hybrid quantum-classical computing including areas such as portfolio optimization and expanding explorations around quantum machine learning.

Applied Materials has expanded its manufacturing and R&D operations in Singapore with the opening of the Tampines Campus, a USD 500 million facility that more than doubles the company's cleanroom capacity in the country. The campus is already operating at volume production.

ICEYE has completed its Series F financing round, raising more than EUR 1 billion in total. The company secured EUR 450 million in new capital, while the overall transaction value – including share sales by existing shareholders – exceeded EUR 1 billion. Following the round, ICEYE's valuation has risen to more than EUR 10 billion.

STMicroelectronics has raised its data centre revenue ambition for 2026 to approximately USD 1 billion, up from previous guidance of "nicely above USD 500 million."

SiC-Wafer

Infineon Technologies and Siemens have announced a collaboration to advance electrical protection in data centres, production facilities and battery storage systems. Infineon will supply silicon carbide power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers.

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The collaboration will bring together Nvidia’s full-stack accelerated computing platforms with Doosan Group’s capabilities in industrial automation, power generation and advanced electronics materials to support next-generation AI infrastructure.

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TVS SCS and ALA will jointly provide integrated supply chain services across production and aftermarket lifecycles, spanning production support, spare parts distribution, inventory optimisation, defence-grade logistics solutions and aftermarket and MRO support services.

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The proposed agreement aims at the timely supply of electronic fuzes as per stipulated specifications and quality standards to undertake proof firing and evaluation or trials of weapons and ammunition being procured by the Indian Army.

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The collaboration brings together Nvidia’s full-stack, end-to-end AI factory platform with LG Group’s global expertise in consumer electronics, robotics, mobility components, smart spaces and data center technologies.

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Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.

US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.

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As AI factories scale globally, this strategic partnership enables memory supply to keep pace with Nvidia’s infrastructure roadmap and the sustained buildout of AI infrastructure worldwide.

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Infineon Technologies says that it will gradually transfer production from its backend manufacturing site in Tijuana, Mexico, to other locations in its global network. The company says the move is aimed at improving scalability, productivity and long-term competitiveness.

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The partnership represents an effort to extend the technologies developed under NTT’s Innovative Optical and Wireless Network (IOWN) into the space domain and accelerating the realization of the IOWN vision.

Robotics

The agreement establishes a cooperative framework to layer Integer Technologies’ DIGIT COMMAND operator software with Cellula Robotics’ mission control software for its advanced unmanned underwater vehicle (UUV) platforms.

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Norwegian company Nanopower Semiconductor’ nPZero Gen1 power management IC extends system lifetime by reducing the load on the main MCU. The agreement aims to reduce IoT power and increase battery life for UK and EU customers.

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Foxconn and Intel are teaming up to jointly develop and deploy next-generation AI infrastructure and intelligent computing platforms, combining Intel's processor and silicon capabilities with Foxconn's manufacturing scale and system integration expertise.

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Building on the companies’ 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence portfolio of Memory and Interface IP.

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The companies will explore the potential to provide optimal products and solutions by combining Murata’s expertise in high-frequency and wireless communications, sensors, timing devices and module design with Xona’s LEO-based positioning and timing synchronization technologies.

US power company Bloom Energy’s fuel cell systems will provide behind-the-meter electricity for Dutch AI cloud company Nebius and help meet demand for the compute capacity underpinning its full-stack AI cloud platform.

GlobalFoundries has completed its previously announced acquisition of the ARC Processor IP Solutions business from Synopsys, combining it with its existing MIPS subsidiary to create what the company describes as a software-to-silicon capability built for physical AI applications.

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Samsung Electronics is relocating its US headquarters from Englewood, New Jersey, to its existing campus in Plano, Texas, the company confirmed on Tuesday, NBC DFW reports. The transition is expected to be completed by the end of the year.

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The partnership brings together Jahwa Electronics’ Korean engineering expertise and Tata AutoComp’s manufacturing ecosystem in India. The companies will manufacture low and high voltage PTC heaters critical for thermal management in electric and hybrid vehicles.

TelePIX_MOU

Indian startup Bellatrix Aerospace and South Korea’s space AI solutions company TelePIX are targeting a 2028 launch and mission commencement and will also cooperate on launch operations, early orbit operations, and overall satellite mission management.

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