Evertiq - First In Electronics News & Expo

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Hithium_partnership

Under the agreement, Turbo Energy will integrate its proprietary AI-driven software platform with Hithium’s battery storage systems, delivering fully optimized, end-to-end solar energy solutions tailored to complex C&I environments.

BMIT_MoU

This strategic partnership aims to strengthen efforts towards fostering indigenous design and production capabilities in advanced technology domains critical to national defence.

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KOG_signing

This is the second series of submarines to be equipped by Indra with its latest generation fully digital electronic warfare systems and state-of-the-art navigation radar, bringing the total number of platforms fitted with these capabilities to 12.

Veloce_proFPGA

Nvidia and Siemens have been able to capture tens of trillions of cycles over a span of just a few days by taking advantage of Siemens’ Veloce proFPGA CS scalable and performance-optimized hardware architecture and combining it with Nvidia’s performance-optimized chip architecture.

quantum-technologies-1

By enabling seamless hybridization between classical HPC and quantum computing, the partnership aims to lower the barrier for industrial and scientific adoption of quantum-accelerated workloads.

TSMC

TSMC is working with Siemens to enhance productivity in custom integrated circuit (IC) design to enable multi-step, multi-tool automations for DRC-centric physical verification with Siemens’ Calibre software.

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Newen

The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.

SDI_Mercedes_Benz

Under the agreement, Samsung SDI will supply high-performance batteries for Mercedes-Benz’s next-generation electric vehicles. Mercedes-Benz plans to use the batteries in future compact and mid-size electric SUVs and coupe models.

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Destinus_JV

The joint venture to be set up during the second half of 2026 will manufacture, market and deliver advanced missile systems, including cruise missiles and ballistic rocket artillery.

We are excited to announce that Poland’s number one celebrity right now will be joining Evertiq Expo in Cracow on May 7th.

The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.

ASML reported total net sales of EUR 8.8 billion and net income of EUR 2.8 billion for the first quarter of 2026.

TVS_agreement

Under the agreement, Hyundai will lead the design of and co-develop the Electric Three-Wheeler (E3W) by leveraging its research and development expertise, advanced mobility technologies and human-centric design approach.

X-raymetrology_Onto

By combining Rigaku’s X-ray technologies with Onto Innovation’s complementary optical metrology and advanced analytics software, the companies aim to deliver next-generation hybrid metrology solutions for increasingly complex semiconductor devices.

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Aixtron has raised its financial guidance for 2026, citing stronger-than-expected demand from the optoelectronics segment, while reporting preliminary figures for the first quarter.

Poing-Germany

Avnet plans to close its logistics centre in Poing by the end of 2026, affecting around 350 employees, according to reporting by Handelsblatt and Merkur.de.

Electronics_REF_ARIF240GaN

REF_ARIF240GaN is specifically designed to support the launch of EZ-PD PMG1-B2, Infineon’s newest USB PD 3.2 controller, featuring up to 240W USB sink capability and integrated buck-boost functionality in a compact single package.

Aerospace_F404

The depot facility for F404 -IN20 engines will be owned, operated and maintained by Indian Air Force (IAF) with GE Aerospace providing technical inputs, training, support staff and supply of necessary spares and specialized equipment.

partnership_Franz26

Seal Dynamics’ presence in Asia and Brazil will connect aerospace OEMs with Greene Tweed’s high-performance solutions, including advanced sealing systems and Xycomp DLF thermoplastic composites, that address their specific challenges.

fiber_network_thedigitalartist

Through this acquisition, Vero will extend its footprint from the Western United States into the Southeast via TEC’s 4,500-mile fiber network. The combined company will reach approximately 444,000 households.

CircleK_partnership

The collaboration is centered around a strategic ambition to expand to more than 350 sites featuring Rechargeries @ Circle K, combining Ionna’s charging technology and driver-first experience with Circle K’s nationwide footprint.

Kawasaki-main-office

Under this agreement, Fujitsu will leverage Chugoku’s intellectual property to launch an advanced power grid operation and maintenance support service for power transmission and distribution companies.

Jeh_LTA

Under the Long-Term Agreement, Jeh Aerospace will manufacture and supply high-precision components for landing gear systems from its facility in Hyderabad, thus becoming part of Liebherr-Aerospace’s global industrial network.

Airlogix_JV

The contract covers mid-range X-wing and delta-wing unmanned aerial systems manufactured in Germany for the Armed Forces of Ukraine. This is the largest German production order for heavy autonomous strike drones to date.

center_NY_Creates

Through this initiative, NY Creates and SCREEN Advanced Technology Center of America (ATCA) intend to connect high-tech organizations in the US and Japan to leverage their networks and drive innovation in SCREEN’s semiconductor R&D focus areas.

groundbreaking-10-04-2026

Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.

Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).

Data-center

Swedish Sivers Semiconductors has entered a collaboration with Jabil, one of the world’s largest EMS providers, to develop an energy-efficient 1.6T pluggable optical transceiver module targeting AI data centres.

MoU_Indra

The two companies will promote a combined solution for Chile’s armoured vehicle program. Hanwha Aerospace will supply armoured vehicle platforms while Indra Group will provide Mission System Equipment and serve as regional coordination lead.

Opens-Analysis-Center-and-Rapidus-Chiplet-Solutions

Japanese semiconductor manufacturer Rapidus has opened a new Analysis Centre and launched its Rapidus Chiplet Solutions (RCS), expanding its development infrastructure ahead of planned advanced semiconductor production in fiscal 2027.

Nanya Technology Corporation has received strategic participation in its private placement from Kioxia, SK hynix subsidiary Solidigm and SanDisk, as the company accelerates investment in advanced DRAM capacity for AI-driven demand.

3D-Nand

Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.

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